Microelectronics & Boards
FPGA / AD / DAQ boards, microwave packaging (LTCC / thin-film / SIP) and RF signal-chain devices for integrated subsystems.
Jingmu Security supplies FPGA, ADC/DAC and data-acquisition boards together with microwave packaging and RF signal-chain devices for integrated subsystems. Capabilities include LTCC/HTCC and thin-film micro-assembly, SiP packaging and custom board design support for signal-processing and sensor front-ends.
Product families
- FPGA / AD / DAQ BoardsSignal processing & acquisition
- Microwave PackagingLTCC / thin-film / SIP / micro-assembly
- RF Chips & Signal ChainRF ICs / analog signal chain
Capabilities
- ▹FPGA, ADC/DAC and data-acquisition boards for signal processing and capture
- ▹LTCC / HTCC, thin-film and SiP microwave packaging and micro-assembly
- ▹RF ICs, amplifiers and analog signal-chain devices
- ▹Custom board and module design support for integrated subsystems
Typical applications
Signal processing and acquisition subsystemsMicrowave and RF module integrationSensor and instrument front-endsRugged embedded computing building blocks
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No pricing is published on this site. Contact our team for specifications, availability and selection support.
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