微电子与板卡

Microelectronics & Boards

FPGA / AD / DAQ boards, microwave packaging (LTCC / thin-film / SIP) and RF signal-chain devices for integrated subsystems.

Product families

FPGA / AD / DAQ Boards
Signal processing & acquisition
Microwave Packaging
LTCC / thin-film / SIP / micro-assembly
RF Chips & Signal Chain
RF ICs / analog signal chain

Capabilities

▹FPGA, ADC/DAC and data-acquisition boards for signal processing and capture
▹LTCC / HTCC, thin-film and SiP microwave packaging and micro-assembly
▹RF ICs, amplifiers and analog signal-chain devices
▹Custom board and module design support for integrated subsystems

Typical applications

Signal processing and acquisition subsystemsMicrowave and RF module integrationSensor and instrument front-endsRugged embedded computing building blocks

Request datasheet or quotation

No pricing is published on this site. Contact our team for specifications, availability and export-review handling.

Contact / RFQ