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Jingmu Security
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Microelectronics & Boards

FPGA / AD / DAQ boards, microwave packaging (LTCC / thin-film / SIP) and RF signal-chain devices for integrated subsystems.

Jingmu Security supplies FPGA, ADC/DAC and data-acquisition boards together with microwave packaging and RF signal-chain devices for integrated subsystems. Capabilities include LTCC/HTCC and thin-film micro-assembly, SiP packaging and custom board design support for signal-processing and sensor front-ends.

Ask about Microelectronics & Boards

Share your application, key requirements, quantity and destination. We will confirm available documentation and selection options for your inquiry; this page does not confirm stock or delivery.

Product families

  • FPGA / AD / DAQ Boards
    Signal processing & acquisition
  • Microwave Packaging
    LTCC / thin-film / SIP / micro-assembly
  • RF Chips & Signal Chain
    RF ICs / analog signal chain

Capabilities

  • ▹FPGA, ADC/DAC and data-acquisition boards for signal processing and capture
  • ▹LTCC / HTCC, thin-film and SiP microwave packaging and micro-assembly
  • ▹RF ICs, amplifiers and analog signal-chain devices
  • ▹Custom board and module design support for integrated subsystems

Typical applications

Signal processing and acquisition subsystemsMicrowave and RF module integrationSensor and instrument front-endsRugged embedded computing building blocks

Other product families

Frequently asked

Which board types do you supply?

FPGA, ADC/DAC and data-acquisition boards for signal processing and capture, supported by custom board and module design for integrated subsystems.

What packaging technologies are covered?

LTCC and HTCC, thin-film and system-in-package microwave packaging and micro-assembly, together with RF ICs, amplifiers and analog signal-chain devices.

Do you build custom modules?

Custom board and module design support is available for integrated subsystems, including sensor and instrument front-ends. Scope, lead time and availability are confirmed on written inquiry.

Last updated 2026-10-20.

What to include in your inquiry

  • Circuit / board function and signal, power and interface requirements
  • Dimensions, stack-up, integration and environmental constraints
  • Required documentation, test criteria and revision identification
  • Quantity, destination country / region and required delivery date

These are selection questions, not a promise of stock, certification, delivery or a particular rating.

Request datasheet or quotation

This website shows specification summaries and selection guidance, not downloadable product files. Email market@jingmusecurity.com for the current datasheet/spec, drawings, availability and selection support. No pricing is published.

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